Xeon E-2124 P 3.3 GHz - Skt 1151 Coffee Lake

Mfg. SKU: CM8068403654414

SKU: 1050096

EAN: 0675901520706

General
Processor family
Intel® Xeon®
Processor socket
LGA 1151 (Socket H4)
Component for
Server/workstation
Memory channels
Dual-channel
Maximum internal memory supported by processor
128 GB
Maximum internal memory
131072 MB
Memory types supported by processor
DDR4-SDRAM
PCI Express configurations
1x16,2x8,1x8+2x4
Supported instruction sets
SSE4.1,SSE4.2,AVX 2.0
Scalability
1S
Intel® Turbo Boost Technology
2.0
Intel® Turbo Boost Technology 2.0 frequency
4.3 GHz
Package width
70 mm
Package depth
116 mm
Package height
101 mm
£289.90 £241.58
Availability: On request
Intel® Optane™ Memory Supported

Intel® Optane™ memory is a revolutionary new class of non-volatile memory that sits in between system memory and storage to accelerate system performance and responsiveness. When combined with the Intel® Rapid Storage Technology Driver, it seamlessly manages multiple tiers of storage while presenting one virtual drive to the OS, ensuring that data frequently used resides on the fastest tier of storage. Intel® Optane™ memory requires specific hardware and software configuration.

Intel® Turbo Boost Technology

Intel® Turbo Boost Technology dynamically increases the processor's frequency as needed by taking advantage of thermal and power headroom to give you a burst of speed when you need it, and increased energy efficiency when you don’t.

Intel® vPro™ Platform Eligibility

Intel® vPro™ Technology is a set of security and manageability capabilities built into the processor aimed at addressing four critical areas of IT security: 1) Threat management, including protection from rootkits, viruses, and malware 2) Identity and web site access point protection 3) Confidential personal and business data protection 4) Remote and local monitoring, remediation, and repair of PCs and workstations.

Intel® Virtualization Technology (VT-x)

Intel® Virtualization Technology (VT-x) allows one hardware platform to function as multiple “virtual” platforms. It offers improved manageability by limiting downtime and maintaining productivity by isolating computing activities into separate partitions.

Intel® Virtualization Technology for Directed I/O (VT-d)

Intel® Virtualization Technology for Directed I/O (VT-d) continues from the existing support for IA-32 (VT-x) and Itanium® processor (VT-i) virtualization adding new support for I/O-device virtualization. Intel VT-d can help end users improve security and reliability of the systems and also improve performance of I/O devices in virtualized environments.

Intel® VT-x with Extended Page Tables (EPT)

Intel® VT-x with Extended Page Tables (EPT), also known as Second Level Address Translation (SLAT), provides acceleration for memory intensive virtualized applications. Extended Page Tables in Intel® Virtualization Technology platforms reduces the memory and power overhead costs and increases battery life through hardware optimization of page table management.

Intel® TSX-NI

Intel® Transactional Synchronization Extensions New Instructions (Intel® TSX-NI) are a set of instructions focused on multi-threaded performance scaling. This technology helps make parallel operations more efficient via improved control of locks in software.

Intel® 64

Intel® 64 architecture delivers 64-bit computing on server, workstation, desktop and mobile platforms when combined with supporting software.¹ Intel 64 architecture improves performance by allowing systems to address more than 4 GB of both virtual and physical memory.

Instruction Set

An instruction set refers to the basic set of commands and instructions that a microprocessor understands and can carry out. The value shown represents which Intel’s instruction set this processor is compatible with.

Instruction Set Extensions

Instruction Set Extensions are additional instructions which can increase performance when the same operations are performed on multiple data objects. These can include SSE (Streaming SIMD Extensions) and AVX (Advanced Vector Extensions).

Idle States

Idle States (C-states) are used to save power when the processor is idle. C0 is the operational state, meaning that the CPU is doing useful work. C1 is the first idle state, C2 the second, and so on, where more power saving actions are taken for numerically higher C-states.

Enhanced Intel SpeedStep® Technology

Enhanced Intel SpeedStep® Technology is an advanced means of enabling high performance while meeting the power-conservation needs of mobile systems. Conventional Intel SpeedStep® Technology switches both voltage and frequency in tandem between high and low levels in response to processor load. Enhanced Intel SpeedStep® Technology builds upon that architecture using design strategies such as Separation between Voltage and Frequency Changes, and Clock Partitioning and Recovery.

Thermal Monitoring Technologies

Thermal Monitoring Technologies protect the processor package and the system from thermal failure through several thermal management features. An on-die Digital Thermal Sensor (DTS) detects the core's temperature, and the thermal management features reduce package power consumption and thereby temperature when required in order to remain within normal operating limits.
Processor
Processor manufacturer
Intel
Processor family
Intel® Xeon®
Processor base frequency
3.3 GHz
Processor cores
4
Processor socket
LGA 1151 (Socket H4)
Component for
Server/workstation
Processor lithography
14 nm
Box
N
Cooler included
N
Processor model
E-2124
Processor threads
4
System bus rate
8 GT/s
Processor operating modes
64-bit
Processor cache
8 MB
Processor cache type
Smart Cache
Thermal Design Power (TDP)
71 W
Processor boost frequency
4.3 GHz
Bus type
DMI3
Memory bandwidth supported by processor (max)
41.6 GB/s
Processor codename
Coffee Lake
Processor ARK ID
134856
Graphics
On-board graphics adapter
Y
Discrete graphics adapter
N
On-board graphics adapter model
Not available
Discrete graphics adapter model
Not available
Features
Execute Disable Bit
Y
Idle States
Y
Thermal Monitoring Technologies
Y
Maximum number of PCI Express lanes
16
PCI Express slots version
3.0
PCI Express configurations
1x16,2x8,1x8+2x4
Supported instruction sets
SSE4.1,SSE4.2,AVX 2.0
Scalability
1S
CPU configuration (max)
1
Embedded options available
N
PCI Express CEM revision
3.0
Market segment
Server
Harmonized System (HS) code
8542310001
Export Control Classification Number (ECCN)
5A992C
Commodity Classification Automated Tracking System (CCATS)
G077159
Processor special features
Intel® Hyper Threading Technology (Intel® HT Technology)
N
Intel® Turbo Boost Technology
2.0
Intel® AES New Instructions (Intel® AES-NI)
Y
Enhanced Intel SpeedStep Technology
Y
Intel Trusted Execution Technology
Y
Intel® Memory Protection Extensions (Intel® MPX)
Y
Intel® Turbo Boost Technology 2.0 frequency
4.3 GHz
Intel® Transactional Synchronization Extensions
Y
Intel Enhanced Halt State
Y
Intel VT-x with Extended Page Tables (EPT)
Y
Intel® Secure Key
Y
Intel TSX-NI
Y
Intel® OS Guard
Y
Intel Software Guard Extensions (Intel SGX)
Y
Intel 64
Y
Intel Secure Key Technology version
1.00
Intel Virtualization Technology (VT-x)
Y
Intel Virtualization Technology for Directed I/O (VT-d)
Y
Intel TSX-NI version
1.00
Intel® Optane™ Memory Ready
Y
Intel® Boot Guard
Y
Intel® vPro™ Platform Eligibility
Y
Memory
Maximum internal memory supported by processor
128 GB
Memory types supported by processor
DDR4-SDRAM
Memory clock speeds supported by processor
2666 MHz
Memory channels
Dual-channel
ECC
Y
Packaging data
Package width
70 mm
Package depth
116 mm
Package height
101 mm
Package weight
316.1 g
Package type
Retail box
Operational conditions
Tjunction
100 °C
Technical details
Processor cache
8192 KB
Product type
Processor
Supported memory types
DDR4-SDRAM
Bus bandwidth
8
Bus type units
GT/s
Launch date
Q3'18
Status
Launched
Maximum memory
128 GB
Processor brand name
Intel® Xeon®
Last change
63903513
Product family
Intel Xeon Processors
Bus speed
8 GT/s
Other features
Maximum internal memory
131072 MB
Weight & dimensions
Processor package size
37.5 x 37.5 mm